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* General refactor of Hardware Specifications, Serial and heading - Nokia & CIG (#114)Simone2023-01-171-16/+19
| | | | | | | | | * General refactor of Hardware Specifications, Serial and heading - Nokia, Cig * Fix ODM * fix odm Co-authored-by: Simone Bortolin <simonebortolin@users.noreply.github.com>
* General refactor of Hardware Specifications, Serial and heading - Huawei (#112)Simone2023-01-171-1/+2
| | | | | | | | | | | * General refactor of Hardware Specifications, Serial and heading - Huawei * trim new line * Fix HiSilicon * fix odm Co-authored-by: Simone Bortolin <simonebortolin@users.noreply.github.com>
* Add XGSPON ONT (#81)Simone2023-01-026-0/+464
* Add ONT XGS-PON * fix * Update ont-hisense-ltf7267-bha+.md Add first information about XGSPON Stick * Update ont-hisense-ltf7267-bha+.md Fix some typos * Add Hisense LFT7267-BHA+ images Add external and internal pictures * Update ont-hisense-ltf7267-bha+.md Add pictures and UART info * Update ont-hisense-ltf7267-bha+.md * Apply suggestions from code review Co-authored-by: Simone Bortolin <simonebortolin@users.noreply.github.com> Co-authored-by: Giammarco Marzano <stich86@gmail.com> Co-authored-by: Giovanni Condello <nanomad@users.noreply.github.com>